Location
Kerver 19A, 5521 Eersel
The Netherlands
Contact
+31 6 19 57 04 04
office@art-tronix.com
Kerver 19A, 5521 Eersel
The Netherlands
+31 6 19 57 04 04
office@art-tronix.com
Laser reballing allows us to apply new tin balls to the connection pads of a BGA with great precision. In this way, the BGA component can be reused. Reballing of BGA components is one of ART-Tronix's specialties. This can range from reusing legacy components to adjusting the tin alloy of the balls for the best assurance of a good connection between the component and the PCB.
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This process that involves the removal of worn or excess tin residues from BGA components is optimized at ART-Tronix. The goal of this process is to achieve convergence in the alloy composition. An example of such a conversion is the transition from a lead-free to a lead-containing composition. Or vice versa, it depends on the specific requirements of the application.
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X-Ray technology allows to perform non-destructive scans. These scans can be used to check parts or components for internal damage. An example is the examination of solder joints for cavities and proper tin flow after a reflow process.
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Curve trace testing is used to measure electronic components. In this process, one "golden" sample component is measured and saved. All other components of the same type will afterwards be compared to this "golden sample" to ensure proper operation.
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